1 (footprint "_0603MP" (version 20211014) (generator pcbnew)
4 (descr "<b>0603 MicroPitch</b>")
5 (fp_text reference "REF**" (at -0.9525 -0.635) (layer "F.SilkS")
6 (effects (font (size 0.666496 0.666496) (thickness 0.146304)) (justify left bottom))
7 (tstamp 08ea7653-fcf2-4de6-bc2d-71c2559866c5)
9 (fp_text value ">VALUE" (at -0.9525 0.9525) (layer "F.Fab")
10 (effects (font (size 0.36576 0.36576) (thickness 0.04064)) (justify left bottom))
11 (tstamp c6f30152-8d59-4f78-bba8-2d4dbdc2be46)
18 ) (layer "F.Adhes") (width 0) (fill solid) (tstamp e4d4e5f7-6687-4207-9525-f44fa6947d43))
19 (fp_line (start 0 -0.254) (end 0 0.254) (layer "F.SilkS") (width 0.2032) (tstamp 8494f3d6-e422-4ed3-afab-572a517aba7f))
20 (fp_line (start -0.432 0.306) (end 0.432 0.306) (layer "F.Fab") (width 0.1016) (tstamp 3a69b14b-04ad-4165-ab2f-4ad1c270b812))
21 (fp_line (start 0.432 -0.306) (end -0.432 -0.306) (layer "F.Fab") (width 0.1016) (tstamp 590cef58-c4cf-4e7a-ac89-6a7a7801e6c8))
27 ) (layer "F.Fab") (width 0) (fill solid) (tstamp 2630aa28-dcfc-4f76-bf4f-eac1115a0083))
33 ) (layer "F.Fab") (width 0) (fill solid) (tstamp 6d4a5dc7-5dd7-4742-b5e4-d512d0913c9b))
34 (pad "1" smd rect (at -0.762 0) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
35 (solder_mask_margin 0.0635) (tstamp 5ce1ec75-6b24-4360-8dcb-9033548b2be2))
36 (pad "2" smd rect (at 0.762 0) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
37 (solder_mask_margin 0.0635) (tstamp 77d09e3e-6f43-44cb-8866-ea235200f8dc))