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115 (add_net /A4_SERCOM3.2_TC3.0)
120 (add_net "Net-(U1-Pad5)")
121 (add_net "Net-(U1-Pad7)")
125 (module "Q3Q-SWAB-A1-00 Temperature + Test Points + OPT3001:FH19C9S05SH10-FFC" (layer Top) (tedit 0) (tstamp 63E6D203)
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200 (module "Q3Q-SWAB-A1-00 Temperature + Test Points + OPT3001:_0603MP" (layer Top) (tedit 0) (tstamp 63E759D2)
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202 (descr "<b>0603 MicroPitch</b>")
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222 (module "Q3Q-SWAB-A1-00 Temperature + Test Points + OPT3001:_0603MP" (layer Top) (tedit 0) (tstamp 63E759F3)
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224 (descr "<b>0603 MicroPitch</b>")
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240 (pad 1 smd rect (at -0.762 0 270) (size 0.8 0.8) (layers Top F.Paste F.Mask)
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244 (module "Q3Q-SWAB-A1-00 Temperature + Test Points + OPT3001:B1,27" (layer Bottom) (tedit 0) (tstamp 63E6D22B)
245 (at 146.1135 102.8472 180)
246 (descr "<b>TEST PAD</b>")
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260 (net 1 GND) (solder_mask_margin 0.0635))
263 (module "Q3Q-SWAB-A1-00 Temperature + Test Points + OPT3001:B1,27" (layer Bottom) (tedit 0) (tstamp 63E6D232)
264 (at 144.0815 101.2216 180)
265 (descr "<b>TEST PAD</b>")
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282 (module "Q3Q-SWAB-A1-00 Temperature + Test Points + OPT3001:B1,27" (layer Bottom) (tedit 0) (tstamp 63E6D239)
283 (at 146.1135 101.2216 180)
284 (descr "<b>TEST PAD</b>")
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301 (module "Q3Q-SWAB-A1-00 Temperature + Test Points + OPT3001:B1,27" (layer Bottom) (tedit 0) (tstamp 63E6D240)
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303 (descr "<b>TEST PAD</b>")
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320 (module "Q3Q-SWAB-A1-00 Temperature + Test Points + OPT3001:B1,27" (layer Bottom) (tedit 0) (tstamp 63E6D247)
321 (at 144.0815 104.4728 180)
322 (descr "<b>TEST PAD</b>")
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339 (module "Q3Q-SWAB-A1-00 Temperature + Test Points + OPT3001:B1,27" (layer Bottom) (tedit 0) (tstamp 63E6D24E)
340 (at 144.0815 102.8472 180)
341 (descr "<b>TEST PAD</b>")
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